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NTGS3443, NVGS3443
Power MOSFET
4.4 Amps, 20 Volts
P ? Channel TSOP ? 6
Features
? Ultra Low R DS(on)
? Higher Efficiency Extending Battery Life
? Miniature TSOP ? 6 Surface Mount Package
? These Devices are Pb ? Free and are RoHS Compliant
? NVGS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC ? Q101
Qualified and PPAP Capable
Applications
? Power Management in Portable and Battery ? Powered Products,
i.e.: Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
http://onsemi.com
4.4 AMPERES
20 VOLTS
R DS(on) = 65 m W
P ? Channel
1 2 5 6
3
4
Rating
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Thermal Resistance
Junction ? to ? Ambient (Note 1)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
? Pulsed Drain Current (T p t 10 m S)
Symbol
V DSS
V GS
R q JA
P d
I D
I DM
Value
? 20
" 12
244
0.5
? 2.2
? 10
Unit
Volts
Volts
° C/W
Watts
Amps
Amps
1
TSOP ? 6
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain Drain Source
6 5 4
443 M G
G
Thermal Resistance
Junction ? to ? Ambient (Note 2)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
? Pulsed Drain Current (T p t 10 m S)
Thermal Resistance
Junction ? to ? Ambient (Note 3)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
? Pulsed Drain Current (T p t 10 m S)
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
R q JA
P d
I D
I DM
R q JA
P d
I D
I DM
T J , T stg
T L
128
1.0
? 3.1
? 14
62.5
2.0
? 4.4
? 20
? 55 to
150
260
° C/W
Watts
Amps
Amps
° C/W
Watts
Amps
Amps
° C
° C
CASE 318G
STYLE 1 1 2 3
Drain Drain Gate
443 = Specific Device Code
M = Date Code*
G = Pb ? Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device Package Shipping ?
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum FR ? 4 or G ? 10 PCB, operating to steady state.
2. Mounted onto a 2 in square FR ? 4 board (1 in sq, 2 oz. Cu. 0.06 ″ thick single
sided), operating to steady state.
3. Mounted onto a 2 in square FR ? 4 board (1 in sq, 2 oz. Cu. 0.06 ″ thick single
sided), t t 5.0 seconds.
NTGS3443T1G TSOP ? 6 3000 / Tape & Reel
(Pb ? Free)
NVGS3443T1G TSOP ? 6 3000 / Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
December, 2012 ? Rev. 5
1
Publication Order Number:
NTGS3443T1/D
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